Distorted Bounding Surface of Clay with Consideration of the Effect of Temperature on Shearing Response

ABSTRACT: The present paper proposes a bounding surface to describe shearing response of clay depending on temperature. As temperature increases, normal consolidation line moves down in the plane of void ratio and mean effective stress. The critical state line, however, does not shifts as much as the normal consolidation line upon temperature change. Therefore, the critical state mean effective stress moves to the pre-consolidation pressure as temperature increases. To naturally capture this, the proposed bounding surface consists of two parts divided at the critical state mean effective stress. The bounding surface was calibrated for the soft Bangkok clay. Elemental simulations from the proposed model showed the model performance to capture the critical state (which is destination of clay upon shearing) without complex hardening and evolution rules compared to the experimental data.